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Ships within 48 hours · Estimated delivery Jul 31 - Aug 5
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Description
No Clean Paste FluxNo Clean Paste Flux Our No Clean Paste Flux is a high performance, no clean paste formulated with a blend of premium synthetic resins, rosin, and thickeners. It is specifically designed for precision electronics work and is widely used in the repair of mobile phones, computers, and PCB assemblies. Suitable for screen printing, stencil printing, pad printing, and dot dispensing, it is particularly effective for BGA, Flip Chip, and other high density
No Clean Paste Flux
Our No Clean Paste Flux is a high-performance, no-clean paste formulated with a blend of premium synthetic resins, rosin, and thickeners. It is specifically designed for precision electronics work and is widely used in the repair of mobile phones, computers, and PCB assemblies. Suitable for screen printing, stencil printing, pad printing, and dot dispensing, it is particularly effective for BGA, Flip Chip, and other high-density interconnect applications.
After reflow, it leaves non-corrosive, non-conductive, and halogen-free residues with excellent insulation resistance, eliminating the need for post-solder cleaning.
View SDS (Syringe) / View SDS (Jar)
View TDS (Syringe) / View TDS (Jar)
✅ Complies with HF / RoHS / REACH standards
Key Features & Advantages
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No-clean formulation: Leaves minimal, safe residue after reflow
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Low-ionic activator system: Ensures high insulation resistance and electrical reliability
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Fast wetting and strong tinning performance
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Excellent reliability: Even in high-density and high-frequency applications
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Non-conductive, non-corrosive residues: Safe for sensitive communication devices
Reheating Instructions
To bring the solder paste to optimal temperature before use, follow these steps:
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Allow the unopened container to thaw naturally at room temperature for approximately 4 hours.
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Do not open the bottle before it is fully thawed.
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Do not heat artificially to accelerate thawing, as this may compromise product performance.
Product Specification
| Specification | Test Standards | |
| Color and Appearance | Milky White Paste | N/A |
| Paste Classification | ROL0 | J-STD-004 |
| Copper Mirror Test | Qualified | JIS Z 3283 |
| Halogen Test | <900 PPM | IED 61249-2-21 |
| Surface Insulation Resistance | >1.0*10 8 ohms | IPC TM-6502.6.3.7 |
| Acid Value | 160 +/- 10mg KOH/g | IPC TM-6502.3.12 |
| Viscosity | 20 +/- Pa.s | Brookfield rotational viscometer |
| Flash Point (Closed Loop) | ASTM D93 | |
| Storage stability (5-30℃) | No Delamination for 12 Months | Accelerated Ageing Test |
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
- Delivery to the USA:
- Standard Shipping : 3-10 business days
- If time is of the essence, please consider selecting expedited delivery for faster service.
Exchange/Return Notes
- We offer a 30-day return/exchange service after receiving.
- Final sale items are not eligible for returns or exchanges.
- To process your return/exchange, please contact us at [email protected]
- Please click here for more details>>> Return & Exchange Policy