EMMC153 EMMC169 Flip Shrapnel To SD Interface Test Socket Burning Socket for Data Recovery Mobile Phone Repair

EMMC153 EMMC169 Flip Shrapnel To SD Interface Test Socket Burning Socket for Data Recovery Mobile Phone Repair1. Type: Test block 2. Interface type: SD 3. Application: Integrated circuit IC 4. Test method: A. Select the limit frame that matches the IC, and place the IC flat in the SOCKET according to the direction B. Insert the SD interface into the card reader and then connect to the computer, select the corresponding test program Features: 1. SOCKET is compatible with the ball and no ball test, and the IC limit frame can be replaced. Compared with similar

1. Type: Test block
2. Interface type: SD
3. Application: Integrated circuit IC
4. Test method:
A. Select the limit frame that matches the IC, and place the IC flat in the SOCKET according to the direction
B. Insert the SD interface into the card reader and then connect to the computer, select the corresponding test program

Features:
1. SOCKET is compatible with the ball and no ball test, and the IC limit frame can be replaced. Compared with similar products, it has a long service life and wide versatility.
2. Compatible with 169-FBGA 153-FBGA at the same time
3. The shrapnel is made of imported beryllium copper by high-precision die stamping, and the head shape is imitated by the probe design, and the latter is hardened and thickened with gold plating to ensure product stability and durability
4. The contact module adopts an overall structure to reduce the problem of repeated positioning, ensure that its contact point is accurately aligned with the IC PAD, and has a high pass rate in one test
5. Use welding structure to ensure good contact and stable testing
6. Flip cover structure, more convenient for manual testing, convenient and simple operation
7. The pressure IC adopts a mold integral molding and a spring self-adaptive structure to ensure that ICs of different thicknesses do not need any adjustments to have good contact. The tested ICs are versatile (the thickness range of 0.6-2.0MM can be tested)
8. The structure adopts injection molding, precise positioning, convenient access to IC, and higher work efficiency

Repair and maintenance:
1. Use an air gun or anti-static brush to remove impurities in the SOCKET seat to make it contact well;
2. Clean the SOCKET with absolute alcohol to clean the attached impurities on the top of the shrapnel and make it contact well;
3. If you find that the shrapnel inside the SOCKET is burned or broken, please purchase the corresponding SOCKET to replace it;
4. It cannot be detected when the USB interface is plugged in. Please check whether the power switch is turned on or whether the computer USB connection is normal;
5. It is strictly forbidden to soak and clean with organic solvents such as thinner water and board washing water to avoid damage to the internal structure of SOCKET;
6. When not in use for a long time, please seal it with an anti-static bag to prevent dust from falling in and affect the product test performance.